产(Chan)品(Pin)简(Jian)介(Jie)
INTRODUCTION
1. 一(Yi)般(Ban)来(Lai)说(Shuo),SMT车(Che)间(Jian)规(Gui)定(Ding)的(De)温(Wen)度(Du)为(Wei)25±(?)3℃(?),湿(Shi)度(Du)为(Wei)40－(?)70%RH;
2. 锡(Xi)膏(Gao)印(Yin)刷(Shua)时(Shi),所(Suo)需(Xu)准(Zhun)备(Bei)的(De)材(Cai)料(Liao)及(Ji)工(Gong)具(Ju)锡(Xi)膏(Gao)、(?)钢(Gang)板(Ban)刮(Gua)刀(Dao)擦(Ca)拭(Shi)纸(Zhi)、(?)无(Wu)尘(Chen)纸(Zhi)清(Qing)洗(Xi)剂(Ji)搅(Jiao)拌(Ban)刀(Dao);
3. 一(Yi)般(Ban)常(Chang)用(Yong)的(De)锡(Xi)膏(Gao)合(He)金(Jin)成(Cheng)份(Fen)为(Wei)Sn/Pb合(He)金(Jin),且(Qie)合(He)金(Jin)比(Bi)例(Li)为(Wei)63/37;
4. 锡(Xi)膏(Gao)中(Zhong)主(Zhu)要(Yao)成(Cheng)份(Fen)分(Fen)为(Wei)两(Liang)大(Da)部(Bu)分(Fen)锡(Xi)粉(Fen)和(He)助(Zhu)焊(Han)剂(Ji)。(?)
5. 助(Zhu)焊(Han)剂(Ji)在(Zai)焊(Han)接(Jie)中(Zhong)的(De)主(Zhu)要(Yao)作(Zuo)用(Yong)是(Shi)去(Qu)除(Chu)氧(Yang)化(Hua)物(Wu)破(Po)坏(Huai)融(Rong)锡(Xi)表(Biao)面(Mian)张(Zhang)力(Li)防(Fang)止(Zhi)再(Zai)度(Du)氧(Yang)化(Hua)。(?)
6. 锡(Xi)膏(Gao)中(Zhong)锡(Xi)粉(Fen)颗(Ke)粒(Li)与(Yu)Flux(助(Zhu)焊(Han)剂(Ji))的(De)体(Ti)积(Ji)之(Zhi)比(Bi)约(Yue)为(Wei)1:1, 重(Zhong)量(Liang)之(Zhi)比(Bi)约(Yue)为(Wei)9:1;
7. 锡(Xi)膏(Gao)的(De)取(Qu)用(Yong)原(Yuan)则(Ze)是(Shi)先(Xian)进(Jin)先(Xian)出(Chu);
8. 锡(Xi)膏(Gao)在(Zai)开(Kai)封(Feng)使(Shi)用(Yong)时(Shi),须(Xu)经(Jing)过(Guo)两(Liang)个(Ge)重(Zhong)要(Yao)的(De)过(Guo)程(Cheng)回(Hui)温(Wen)搅(Jiao)拌(Ban);
9. 钢(Gang)板(Ban)常(Chang)见(Jian)的(De)制(Zhi)作(Zuo)方(Fang)法(Fa)为(Wei)蚀(Shi)刻(Ke)激(Ji)光(Guang)电(Dian)铸(Zhu);
10. SMT的(De)全(Quan)称(Cheng)是(Shi)Surface mount(或(Huo)mounting) technology,中(Zhong)文(Wen)意(Yi)思(Si)为(Wei)表(Biao)面(Mian)粘(Zhan)着(Zhuo)（(?)或(Huo)贴(Tie)装(Zhuang)）(?)技(Ji)术(Shu);
11. ESD的(De)全(Quan)称(Cheng)是(Shi)Electro-static discharge, 中(Zhong)文(Wen)意(Yi)思(Si)为(Wei)静(Jing)电(Dian)放(Fang)电(Dian);
12. 制(Zhi)作(Zuo)SMT设(She)备(Bei)程(Cheng)序(Xu)时(Shi), 程(Cheng)序(Xu)中(Zhong)包(Bao)括(Kuo)五(Wu)大(Da)部(Bu)分(Fen), 此(Ci)五(Wu)部(Bu)分(Fen)为(Wei)PCB data; Mark data; Feeder data; Nozzle data; Part data;
13. 无(Wu)铅(Qian)焊(Han)锡(Xi)Sn/Ag/Cu 96.5/3.0/0.5的(De)熔(Rong)点(Dian)为(Wei) 217C,Sn96.5/Ag3.5为(Wei)熔(Rong)点(Dian)为(Wei)221;
14. 零(Ling)件(Jian)干(Gan)燥(Zao)箱(Xiang)的(De)管(Guan)制(Zhi)相(Xiang)对(Dui)温(Wen)湿(Shi)度(Du)为(Wei) < 10%RH;
15. 常(Chang)用(Yong)的(De)被(Bei)动(Dong)元(Yuan)器(Qi)件(Jian)(Passive Devices)有(You)：(?)电(Dian)阻(Zu)、(?)电(Dian)容(Rong)、(?)点(Dian)感(Gan)（(?)或(Huo)二(?)极(Ji)体(Ti)）(?)等(Deng)；(?)主(Zhu)动(Dong)元(Yuan)器(Qi)件(Jian)(Active Devices)有(You)：(?)电(Dian)晶(Jing)体(Ti)、(?)IC等(Deng);
16. 常(Chang)用(Yong)的(De)SMT钢(Gang)板(Ban)的(De)材(Cai)质(Zhi)为(Wei)不(Bu)锈(Xiu)钢(Gang);
17. 常(Chang)用(Yong)的(De)SMT钢(Gang)板(Ban)的(De)厚(Hou)度(Du)为(Wei)0.15mm(或(Huo)0.12mm);
18. 静(Jing)电(Dian)电(Dian)荷(He)产(Chan)生(Sheng)的(De)种(Zhong)类(Lei)有(You)摩(Mo)擦(Ca)分(Fen)离(Li)感(Gan)应(Ying)静(Jing)电(Dian)传(Chuan)导(Dao)等(Deng)静(Jing)电(Dian)电(Dian)荷(He)对(Dui)电(Dian)子(Zi)工(Gong)业(Ye)的(De)影(Ying)响(Xiang)为(Wei)ESD失(Shi)效(Xiao)静(Jing)电(Dian)污(Wu)染(Ran)静(Jing)电(Dian)消(Xiao)除(Chu)的(De)三(San)种(Zhong)原(Yuan)理(Li)为(Wei)静(Jing)电(Dian)中(Zhong)和(He)接(Jie)地(Di)屏(Ping)蔽(Bi)。(?)
19. 英(Ying)制(Zhi)尺(Chi)寸(Cun)长(Chang)x宽(Kuan)0603= 0.06inch*0.03inch公(Gong)制(Zhi)尺(Chi)寸(Cun)长(Chang)x宽(Kuan)3216=3.2mm*1.6mm;
20. 排(Pai)阻(Zu)ERB-05604-J81第(Di)8码(Ma)“(?)4”(?)表(Biao)示(Shi)为(Wei)4 个(Ge)回(Hui)路(Lu),阻(Zu)值(Zhi)为(Wei)56欧(Ou)姆(Mu)。(?)电(Dian)容(Rong)ECA-0105Y-M31容(Rong)值(Zhi)为(Wei)C=106PF=1NF =1X10-6F;
21. ECN中(Zhong)文(Wen)全(Quan)称(Cheng)为(Wei)工(Gong)程(Cheng)变(Bian)更(Geng)通(Tong)知(Zhi)单(Dan)SWR中(Zhong)文(Wen)全(Quan)称(Cheng)为(Wei)特(Te)殊(Shu)需(Xu)求(Qiu)工(Gong)作(Zuo)单(Dan) 必(Bi)须(Xu)由(You)各(Ge)相(Xiang)关(Guan)部(Bu)门(Men)会(Hui)签(Qian), 文(Wen)件(Jian)中(Zhong)心(Xin)分(Fen)发(Fa), 方(Fang)为(Wei)有(You)效(Xiao);
22. ５(?)S的(De)具(Ju)体(Ti)内(Nei)容(Rong)为(Wei)整(Zheng)理(Li)整(Zheng)顿(Dun)清(Qing)扫(Sao)清(Qing)洁(Jie)素(Su)养(Yang);
23. PCB真(Zhen)空(Kong)包(Bao)装(Zhuang)的(De)目(Mu)的(De)是(Shi)防(Fang)尘(Chen)及(Ji)防(Fang)潮(Chao);
24. 品(Pin)质(Zhi)政(Zheng)策(Ce)为(Wei)全(Quan)面(Mian)品(Pin)管(Guan)贯(Guan)彻(Che)制(Zhi)度(Du)提(Ti)供(Gong)客(Ke)户(Hu)需(Xu)求(Qiu)的(De)品(Pin)质(Zhi)全(Quan)员(Yuan)参(Can)与(Yu)及(Ji)时(Shi) 处(Chu)理(Li)以(Yi)达(Da)成(Cheng)零(Ling)缺(Que)点(Dian)的(De)目(Mu)标(Biao);
25. 品(Pin)质(Zhi)三(San)不(Bu)政(Zheng)策(Ce)为(Wei)不(Bu)接(Jie)受(Shou)不(Bu)良(Liang)品(Pin)不(Bu)制(Zhi)造(Zao)不(Bu)良(Liang)品(Pin)不(Bu)流(Liu)出(Chu)不(Bu)良(Liang)品(Pin);
26. QC七(Qi)大(Da)手(Shou)法(Fa)中(Zhong)鱼(Yu)骨(Gu)查(Cha)原(Yuan)因(Yin)中(Zhong)４(?)M1H分(Fen)别(Bie)是(Shi)指(Zhi)（(?)中(Zhong)文(Wen)）(?): 人(Ren) 机(Ji)器(Qi)物(Wu)料(Liao)方(Fang)法(Fa)环(Huan)境(Jing);
27. 锡(Xi)膏(Gao)的(De)成(Cheng)份(Fen)包(Bao)含(Han)金(Jin)属(Shu)粉(Fen)末(Mo)溶(Rong)济(Ji)助(Zhu)焊(Han)剂(Ji)抗(Kang)垂(Chui)流(Liu)剂(Ji)活(Huo)性(Xing)剂(Ji)按(An)重(Zhong)量(Liang)分(Fen)金(Jin)属(Shu)粉(Fen)末(Mo)占(Zhan)85-92%按(An)体(Ti)积(Ji)分(Fen)金(Jin)属(Shu)粉(Fen)末(Mo)占(Zhan)50%其(Qi)中(Zhong)金(Jin)属(Shu)粉(Fen)末(Mo)主(Zhu)要(Yao)成(Cheng)份(Fen)为(Wei)锡(Xi)和(He)铅(Qian), 比(Bi)例(Li)为(Wei)63/37熔(Rong)点(Dian)为(Wei)183℃(?);
28. 锡(Xi)膏(Gao)使(Shi)用(Yong)时(Shi)必(Bi)须(Xu)从(Cong)冰(Bing)箱(Xiang)中(Zhong)取(Qu)出(Chu)回(Hui)温(Wen), 目(Mu)的(De)是(Shi)让(Rang)冷(Leng)藏(Cang)的(De)锡(Xi)膏(Gao)温(Wen)度(Du)回(Hui)复(Fu)常(Chang)温(Wen)以(Yi)利(Li)印(Yin)刷(Shua)。(?)如(Ru)果(Guo)不(Bu)回(Hui)温(Wen)则(Ze)在(Zai)PCBA进(Jin)Reflow后(Hou)易(Yi)产(Chan)生(Sheng)的(De)不(Bu)良(Liang)为(Wei)锡(Xi)珠(Zhu);
29. 机(Ji)器(Qi)之(Zhi)文(Wen)件(Jian)供(Gong)给(Gei)模(Mo)式(Shi)有(You)准(Zhun)备(Bei)模(Mo)式(Shi)优(You)先(Xian)交(Jiao)换(Huan)模(Mo)式(Shi)交(Jiao)换(Huan)模(Mo)式(Shi)和(He)速(Su)接(Jie)模(Mo)式(Shi);
30. SMT的(De)PCB定(Ding)位(Wei)方(Fang)式(Shi)有(You)真(Zhen)空(Kong)定(Ding)位(Wei)机(Ji)械(Xie)孔(Kong)定(Ding)位(Wei)双(Shuang)边(Bian)夹(Jia)定(Ding)位(Wei)及(Ji)板(Ban)边(Bian)定(Ding)位(Wei);
31. 丝(Si)印(Yin)（(?)符(Fu)号(Hao)）(?)为(Wei)272的(De)电(Dian)阻(Zu)，(?)阻(Zu)值(Zhi)为(Wei) 2700Ω(?) ，(?)阻(Zu)值(Zhi)为(Wei)4.8MΩ(?)的(De)电(Dian)阻(Zu)的(De)符(Fu)号(Hao)（(?)丝(Si)印(Yin)）(?)为(Wei)485;
32. BGA本(Ben)体(Ti)上(Shang)的(De)丝(Si)印(Yin)包(Bao)含(Han)厂(Chang)商(Shang)厂(Chang)商(Shang)料(Liao)号(Hao) 规(Gui)格(Ge)和(He)Datecode/(Lot No)等(Deng)信(Xin)息(Xi);
33. 208pinQFP的(De)pitch为(Wei)0.5mm ;
34. QC七(Qi)大(Da)手(Shou)法(Fa)中(Zhong), 鱼(Yu)骨(Gu)图(Tu)强(Qiang)调(Diao)寻(Xun)找(Zhao)因(Yin)果(Guo)关(Guan)系(Xi);
37. CPK指(Zhi): 目(Mu)前(Qian)实(Shi)际(Ji)状(Zhuang)况(Kuang)下(Xia)的(De)制(Zhi)程(Cheng)能(Neng)力(Li);
38. 助(Zhu)焊(Han)剂(Ji)在(Zai)恒(Heng)温(Wen)区(Qu)开(Kai)始(Shi)挥(Hui)发(Fa)进(Jin)行(Xing)化(Hua)学(Xue)清(Qing)洗(Xi)动(Dong)作(Zuo);
39. 理(Li)想(Xiang)的(De)冷(Leng)却(Que)区(Qu)曲(Qu)线(Xian)和(He)回(Hui)流(Liu)区(Qu)曲(Qu)线(Xian)镜(Jing)像(Xiang)关(Guan)系(Xi);
40. RSS曲(Qu)线(Xian)为(Wei)升(Sheng)温(Wen)→(?)恒(Heng)温(Wen)→(?)回(Hui)流(Liu)→(?)冷(Leng)却(Que)曲(Qu)线(Xian);
41.我(Wo)们(Men)现(Xian)使(Shi)用(Yong)的(De)PCB材(Cai)质(Zhi)为(Wei)FR-4;
42. PCB翘(Qiao)曲(Qu)规(Gui)格(Ge)不(Bu)超(Chao)过(Guo)其(Qi)对(Dui)角(Jiao)线(Xian)的(De)0.7%;
43. STENCIL 制(Zhi)作(Zuo)激(Ji)光(Guang)切(Qie)割(Ge)是(Shi)可(Ke)以(Yi)再(Zai)重(Zhong)工(Gong)的(De)方(Fang)法(Fa);
44. 目(Mu)前(Qian)计(Ji)算(Suan)机(Ji)主(Zhu)板(Ban)上(Shang)常(Chang)被(Bei)使(Shi)用(Yong)之(Zhi)BGA球(Qiu)径(Jing)为(Wei)0.76mm;
45. ABS系(Xi)统(Tong)为(Wei)绝(Jue)对(Dui)坐(Zuo)标(Biao);
46. 陶(Tao)瓷(Ci)芯(Xin)片(Pian)电(Dian)容(Rong)ECA-0105Y-K31误(Wu)差(Cha)为(Wei)±(?)10%;
47. Panasert松(Song)下(Xia)全(Quan)自(Zi)动(Dong)贴(Tie)片(Pian)机(Ji)其(Qi)电(Dian)压(Ya)为(Wei)3?200±(?)10VAC;
48. SMT零(Ling)件(Jian)包(Bao)装(Zhuang)其(Qi)卷(Juan)带(Dai)式(Shi)盘(Pan)直(Zhi)径(Jing)为(Wei)13寸(Cun), ７(?)寸(Cun);
49. SMT一(Yi)般(Ban)钢(Gang)板(Ban)开(Kai)孔(Kong)要(Yao)比(Bi)PCB PAD 小(Xiao)4um可(Ke)以(Yi)防(Fang)止(Zhi)锡(Xi)球(Qiu)不(Bu)良(Liang)之(Zhi)现(Xian)象(Xiang);
50. 按(An)照(Zhao)《(?)PCBA检(Jian)验(Yan)规(Gui)》(?)范(Fan)当(Dang)二(?)面(Mian)角(Jiao)＞(?)９(?)０(?)度(Du)时(Shi)表(Biao)示(Shi)锡(Xi)膏(Gao)与(Yu)波(Bo)焊(Han)体(Ti)无(Wu)附(Fu)着(Zhuo)性(Xing);
51. IC拆(Chai)包(Bao)后(Hou)湿(Shi)度(Du)显(Xian)示(Shi)卡(Ka)上(Shang)湿(Shi)度(Du)在(Zai)大(Da)于(Yu)30%的(De)情(Qing)况(Kuang)下(Xia)表(Biao)示(Shi)IC受(Shou)潮(Chao)且(Qie)吸(Xi)湿(Shi);
52. 锡(Xi)膏(Gao)成(Cheng)份(Fen)中(Zhong)锡(Xi)粉(Fen)与(Yu)助(Zhu)焊(Han)剂(Ji)的(De)重(Zhong)量(Liang)比(Bi)和(He)体(Ti)积(Ji)比(Bi)正(Zheng)确(Que)的(De)是(Shi)90%:10% ,50%:50%;
53.早(Zao)期(Qi)之(Zhi)表(Biao)面(Mian)粘(Zhan)装(Zhuang)技(Ji)术(Shu)源(Yuan)自(Zi)于(Yu)20世(Shi)纪(Ji)60年(Nian)代(Dai)中(Zhong)期(Qi)之(Zhi)军(Jun)用(Yong)及(Ji)航(Hang)空(Kong)电(Dian)子(Zi)领(Ling)域(Yu);
54.目(Mu)前(Qian)SMT最(Zui)常(Chang)使(Shi)用(Yong)的(De)焊(Han)锡(Xi)膏(Gao)Sn和(He)Pb的(De)含(Han)量(Liang)各(Ge)为(Wei): 63Sn+37Pb;
55.常(Chang)见(Jian)的(De)带(Dai)宽(Kuan)为(Wei)8mm的(De)纸(Zhi)带(Dai)料(Liao)盘(Pan)送(Song)料(Liao)间(Jian)距(Ju)为(Wei)4mm;
56. 在(Zai)1970年(Nian)代(Dai)早(Zao)期(Qi),业(Ye)界(Jie)中(Zhong)新(Xin)门(Men)一(Yi)种(Zhong)SMD, 为(Wei)“(?)密(Mi)封(Feng)式(Shi)无(Wu)脚(Jiao)芯(Xin)片(Pian)载(Zai)体(Ti)”(?), 常(Chang)以(Yi)HCC简(Jian)代(Dai)之(Zhi);
57. 符(Fu)号(Hao)为(Wei)272之(Zhi)组(Zu)件(Jian)的(De)阻(Zu)值(Zhi)应(Ying)为(Wei)2.7K欧(Ou)姆(Mu);
58. 100NF组(Zu)件(Jian)的(De)容(Rong)值(Zhi)与(Yu)0.10uf相(Xiang)同(Tong);
59. 63Sn+37Pb之(Zhi)共(Gong)晶(Jing)点(Dian)为(Wei)183℃(?);
60. SMT使(Shi)用(Yong)量(Liang)最(Zui)大(Da)的(De)电(Dian)子(Zi)零(Ling)件(Jian)材(Cai)质(Zhi)是(Shi)陶(Tao)瓷(Ci);
61. 回(Hui)焊(Han)炉(Lu)温(Wen)度(Du)曲(Qu)线(Xian)其(Qi)曲(Qu)线(Xian)最(Zui)高(Gao)温(Wen)度(Du)215C最(Zui)适(Shi)宜(Yi);
62. 锡(Xi)炉(Lu)检(Jian)验(Yan)时(Shi)，(?)锡(Xi)炉(Lu)的(De)温(Wen)度(Du)245C较(Jiao)合(He)适(Shi);
63. SMT零(Ling)件(Jian)包(Bao)装(Zhuang)其(Qi)卷(Juan)带(Dai)式(Shi)盘(Pan)直(Zhi)径(Jing)13寸(Cun),7寸(Cun);
64. 钢(Gang)板(Ban)的(De)开(Kai)孔(Kong)型(Xing)式(Shi)方(Fang)形(Xing)三(San)角(Jiao)形(Xing)圆(Yuan)形(Xing),星(Xing)形(Xing),本(Ben)磊(Lei)形(Xing);
65. 目(Mu)前(Qian)使(Shi)用(Yong)之(Zhi)计(Ji)算(Suan)机(Ji)边(Bian)PCB, 其(Qi)材(Cai)质(Zhi)为(Wei): 玻(Bo)纤(Xian)板(Ban);
66. Sn62Pb36Ag2之(Zhi)焊(Han)锡(Xi)膏(Gao)主(Zhu)要(Yao)试(Shi)用(Yong)于(Yu)何(He)种(Zhong)基(Ji)板(Ban)陶(Tao)瓷(Ci)板(Ban);
67. 以(Yi)松(Song)香(Xiang)为(Wei)主(Zhu)之(Zhi)助(Zhu)焊(Han)剂(Ji)可(Ke)分(Fen)四(Si)种(Zhong): RRARSARMA;
68. SMT段(Duan)排(Pai)阻(Zu)有(You)无(Wu)方(Fang)向(Xiang)性(Xing)无(Wu);
69. 目(Mu)前(Qian)市(Shi)面(Mian)上(Shang)售(Shou)之(Zhi)锡(Xi)膏(Gao)，(?)实(Shi)际(Ji)只(Zhi)有(You)4小(Xiao)时(Shi)的(De)粘(Zhan)性(Xing)时(Shi)间(Jian);
70. SMT设(She)备(Bei)一(Yi)般(Ban)使(Shi)用(Yong)之(Zhi)额(E)定(Ding)气(Qi)压(Ya)为(Wei)5KG/cm2;
71. 正(Zheng)面(Mian)PTH, 反(Fan)面(Mian)SMT过(Guo)锡(Xi)炉(Lu)时(Shi)使(Shi)用(Yong)何(He)种(Zhong)焊(Han)接(Jie)方(Fang)式(Shi)扰(Rao)流(Liu)双(Shuang)波(Bo)焊(Han);
72. SMT常(Chang)见(Jian)之(Zhi)检(Jian)验(Yan)方(Fang)法(Fa): 目(Mu)视(Shi)检(Jian)验(Yan)X光(Guang)检(Jian)验(Yan)机(Ji)器(Qi)视(Shi)觉(Jue)检(Jian)验(Yan)
73. 铬(Ge)铁(Tie)修(Xiu)理(Li)零(Ling)件(Jian)热(Re)传(Chuan)导(Dao)方(Fang)式(Shi)为(Wei)传(Chuan)导(Dao)+对(Dui)流(Liu);
74. 目(Mu)前(Qian)BGA材(Cai)料(Liao)其(Qi)锡(Xi)球(Qiu)的(De)主(Zhu)要(Yao)成(Cheng)Sn90 Pb10;
75. 钢(Gang)板(Ban)的(De)制(Zhi)作(Zuo)方(Fang)法(Fa)雷(Lei)射(She)切(Qie)割(Ge)电(Dian)铸(Zhu)法(Fa)化(Hua)学(Xue)蚀(Shi)刻(Ke);
76. 迥(Jiong)焊(Han)炉(Lu)的(De)温(Wen)度(Du)按(An): 利(Li)用(Yong)测(Ce)温(Wen)器(Qi)量(Liang)出(Chu)适(Shi)用(Yong)之(Zhi)温(Wen)度(Du);
77. 迥(Jiong)焊(Han)炉(Lu)之(Zhi)SMT半(Ban)成(Cheng)品(Pin)于(Yu)出(Chu)口(Kou)时(Shi)其(Qi)焊(Han)接(Jie)状(Zhuang)况(Kuang)是(Shi)零(Ling)件(Jian)固(Gu)定(Ding)于(Yu)PCB上(Shang);
78. 现(Xian)代(Dai)质(Zhi)量(Liang)管(Guan)理(Li)发(Fa)展(Zhan)的(De)历(Li)程(Cheng)TQC-TQA-TQM;
79. ICT测(Ce)试(Shi)是(Shi)针(Zhen)床(Chuang)测(Ce)试(Shi);
80. ICT之(Zhi)测(Ce)试(Shi)能(Neng)测(Ce)电(Dian)子(Zi)零(Ling)件(Jian)采(Cai)用(Yong)静(Jing)态(Tai)测(Ce)试(Shi);
81. 焊(Han)锡(Xi)特(Te)性(Xing)是(Shi)融(Rong)点(Dian)比(Bi)其(Qi)它(Ta)金(Jin)属(Shu)低(Di)物(Wu)理(Li)性(Xing)能(Neng)满(Man)足(Zu)焊(Han)接(Jie)条(Tiao)件(Jian)低(Di)温(Wen)时(Shi)流(Liu)动(Dong)性(Xing)比(Bi)其(Qi)它(Ta)金(Jin)属(Shu)好(Hao);
82. 迥(Jiong)焊(Han)炉(Lu)零(Ling)件(Jian)更(Geng)换(Huan)制(Zhi)程(Cheng)条(Tiao)件(Jian)变(Bian)更(Geng)要(Yao)重(Zhong)新(Xin)测(Ce)量(Liang)测(Ce)度(Du)曲(Qu)线(Xian);
83. 西(Xi)门(Men)子(Zi)80F/S属(Shu)于(Yu)较(Jiao)电(Dian)子(Zi)式(Shi)控(Kong)制(Zhi)传(Chuan)动(Dong);
84. 锡(Xi)膏(Gao)测(Ce)厚(Hou)仪(Yi)是(Shi)利(Li)用(Yong)Laser光(Guang)测(Ce): 锡(Xi)膏(Gao)度(Du)锡(Xi)膏(Gao)厚(Hou)度(Du)锡(Xi)膏(Gao)印(Yin)出(Chu)之(Zhi)宽(Kuan)度(Du);
85. SMT零(Ling)件(Jian)供(Gong)料(Liao)方(Fang)式(Shi)有(You)振(Zhen)动(Dong)式(Shi)供(Gong)料(Liao)器(Qi)盘(Pan)状(Zhuang)供(Gong)料(Liao)器(Qi)卷(Juan)带(Dai)式(Shi)供(Gong)料(Liao)器(Qi);
86. SMT设(She)备(Bei)运(Yun)用(Yong)哪(Na)些(Xie)机(Ji)构(Gou): 凸(Tu)轮(Lun)机(Ji)构(Gou)边(Bian)杆(Gan)机(Ji)构(Gou) 螺(Luo)杆(Gan)机(Ji)构(Gou)滑(Hua)动(Dong)机(Ji)构(Gou);
87. 目(Mu)检(Jian)段(Duan)若(Ruo)无(Wu)法(Fa)确(Que)认(Ren)则(Ze)需(Xu)依(Yi)照(Zhao)何(He)项(Xiang)作(Zuo)业(Ye)BOM厂(Chang)商(Shang)确(Que)认(Ren)样(Yang)品(Pin)板(Ban);
88. 若(Ruo)零(Ling)件(Jian)包(Bao)装(Zhuang)方(Fang)式(Shi)为(Wei)12w8P, 则(Ze)计(Ji)数(Shu)器(Qi)Pinth尺(Chi)寸(Cun)须(Xu)调(Diao)整(Zheng)每(Mei)次(Ci)进(Jin)8mm;
89.迥(Jiong)焊(Han)机(Ji)的(De)种(Zhong)类(Lei): 热(Re)风(Feng)式(Shi)迥(Jiong)焊(Han)炉(Lu)氮(Dan)气(Qi)迥(Jiong)焊(Han)炉(Lu)laser迥(Jiong)焊(Han)炉(Lu)红(Hong)外(Wai)线(Xian)迥(Jiong)焊(Han)炉(Lu);
90. SMT零(Ling)件(Jian)样(Yang)品(Pin)试(Shi)作(Zuo)可(Ke)采(Cai)用(Yong)的(De)方(Fang)法(Fa)流(Liu)线(Xian)式(Shi)生(Sheng)产(Chan)手(Shou)印(Yin)机(Ji)器(Qi)贴(Tie)装(Zhuang)手(Shou)印(Yin)手(Shou)贴(Tie)装(Zhuang);
91. 常(Chang)用(Yong)的(De)MARK形(Xing)状(Zhuang)有(You)圆(Yuan)形(Xing),“(?)十(Shi)”(?)字(Zi)形(Xing) 正(Zheng)方(Fang)形(Xing),菱(Ling)形(Xing),三(San)角(Jiao)形(Xing),万(Wan)字(Zi)形(Xing);
92. SMT段(Duan)因(Yin)Reflow Profile设(She)置(Zhi)不(Bu)当(Dang), 可(Ke)能(Neng)造(Zao)成(Cheng)零(Ling)件(Jian)微(Wei)裂(Lie)的(De)是(Shi)预(Yu)热(Re)区(Qu)冷(Leng)却(Que)区(Qu);
93.SMT段(Duan)零(Ling)件(Jian)两(Liang)端(Duan)受(Shou)热(Re)不(Bu)均(Jun)匀(Yun)易(Yi)造(Zao)成(Cheng)空(Kong)焊(Han)偏(Pian)位(Wei)墓(Mu)碑(Bei);
94. SMT零(Ling)件(Jian)维(Wei)修(Xiu)的(De)工(Gong)具(Ju)有(You)烙(Lao)铁(Tie)热(Re)风(Feng)拔(Ba)取(Qu)器(Qi)吸(Xi)锡(Xi)枪(Qiang),镊(Nie)子(Zi);
95. QC分(Fen)为(Wei)IQCIPQC.FQCOQC;
96. 高(Gao)速(Su)贴(Tie)片(Pian)机(Ji)可(Ke)贴(Tie)装(Zhuang)电(Dian)阻(Zu)电(Dian)容(Rong) IC.晶(Jing)体(Ti)管(Guan);
97. 静(Jing)电(Dian)的(De)特(Te)点(Dian)小(Xiao)电(Dian)流(Liu)受(Shou)湿(Shi)度(Du)影(Ying)响(Xiang)较(Jiao)大(Da);
98. 高(Gao)速(Su)机(Ji)与(Yu)泛(Fan)用(Yong)机(Ji)的(De)Cycle time应(Ying)尽(Jin)量(Liang)均(Jun)衡(Heng);
99. 品(Pin)质(Zhi)的(De)真(Zhen)意(Yi)就(Jiu)是(Shi)第(Di)一(Yi)次(Ci)就(Jiu)做(Zuo)好(Hao);
100. 贴(Tie)片(Pian)机(Ji)应(Ying)先(Xian)贴(Tie)小(Xiao)零(Ling)件(Jian)，(?)后(Hou)贴(Tie)大(Da)零(Ling)件(Jian);
101. BIOS是(Shi)一(Yi)种(Zhong)基(Ji)本(Ben)输(Shu)入(Ru)输(Shu)出(Chu)系(Xi)统(Tong)，(?)全(Quan)英(Ying)文(Wen)为(Wei)：(?)Base Input/Output System;
102. SMT零(Ling)件(Jian)依(Yi)据(Ju)零(Ling)件(Jian)脚(Jiao)有(You)无(Wu)可(Ke)分(Fen)为(Wei)LEAD与(Yu)LEADLESS两(Liang)种(Zhong);
103. 常(Chang)见(Jian)的(De)自(Zi)动(Dong)放(Fang)置(Zhi)机(Ji)有(You)三(San)种(Zhong)基(Ji)本(Ben)型(Xing)态(Tai), 接(Jie)续(Xu)式(Shi)放(Fang)置(Zhi)型(Xing), 连(Lian)续(Xu)式(Shi)放(Fang)置(Zhi)型(Xing)和(He)大(Da)量(Liang)移(Yi)送(Song)式(Shi)放(Fang)置(Zhi)机(Ji);
104. SMT制(Zhi)程(Cheng)中(Zhong)没(Mei)有(You)LOADER也(Ye)可(Ke)以(Yi)生(Sheng)产(Chan);
105. SMT流(Liu)程(Cheng)是(Shi)送(Song)板(Ban)系(Xi)统(Tong)-锡(Xi)膏(Gao)印(Yin)刷(Shua)机(Ji)-高(Gao)速(Su)机(Ji)-泛(Fan)用(Yong)机(Ji)-迥(Jiong)流(Liu)焊(Han)-收(Shou)板(Ban)机(Ji);
106. 温(Wen)湿(Shi)度(Du)敏(Min)感(Gan)零(Ling)件(Jian)开(Kai)封(Feng)时(Shi), 湿(Shi)度(Du)卡(Ka)圆(Yuan)圈(Quan)内(Nei)显(Xian)示(Shi)颜(Yan)色(Se)为(Wei)蓝(Lan)色(Se),零(Ling)件(Jian)方(Fang)可(Ke)使(Shi)用(Yong);
107. 尺(Chi)寸(Cun)规(Gui)格(Ge)20mm不(Bu)是(Shi)料(Liao)带(Dai)的(De)宽(Kuan)度(Du);
108.制(Zhi)程(Cheng)中(Zhong)因(Yin)印(Yin)刷(Shua)不(Bu)良(Liang)造(Zao)成(Cheng)短(Duan)路(Lu)的(De)原(Yuan)因(Yin)a. 锡(Xi)膏(Gao)金(Jin)属(Shu)含(Han)量(Liang)不(Bu)够(Gou)，(?)造(Zao)成(Cheng)塌(Ta)陷(Xian)b. 钢(Gang)板(Ban)开(Kai)孔(Kong)过(Guo)大(Da)，(?)造(Zao)成(Cheng)锡(Xi)量(Liang)过(Guo)多(Duo)c. 钢(Gang)板(Ban)品(Pin)质(Zhi)不(Bu)佳(Jia)，(?)下(Xia)锡(Xi)不(Bu)良(Liang)，(?)换(Huan)激(Ji)光(Guang)切(Qie)割(Ge)模(Mo)板(Ban)d. Stencil背(Bei)面(Mian)残(Can)有(You)锡(Xi)膏(Gao)，(?)降(Jiang)低(Di)刮(Gua)刀(Dao)压(Ya)力(Li)，(?)采(Cai)用(Yong)适(Shi)当(Dang)的(De)VACCUM和(He)SOLVENT
109.一(Yi)般(Ban)回(Hui)焊(Han)炉(Lu)Profile各(Ge)区(Qu)的(De)主(Zhu)要(Yao)工(Gong)程(Cheng)目(Mu)的(De):a.预(Yu)热(Re)区(Qu)；(?)工(Gong)程(Cheng)目(Mu)的(De)：(?)锡(Xi)膏(Gao)中(Zhong)容(Rong)剂(Ji)挥(Hui)发(Fa)。(?)b.均(Jun)温(Wen)区(Qu)；(?)工(Gong)程(Cheng)目(Mu)的(De)：(?)助(Zhu)焊(Han)剂(Ji)活(Huo)化(Hua)，(?)去(Qu)除(Chu)氧(Yang)化(Hua)物(Wu)；(?)蒸(Zheng)发(Fa)多(Duo)余(Yu)水(Shui)份(Fen)。(?)c.回(Hui)焊(Han)区(Qu)；(?)工(Gong)程(Cheng)目(Mu)的(De)：(?)焊(Han)锡(Xi)熔(Rong)融(Rong)。(?)d.冷(Leng)却(Que)区(Qu)；(?)工(Gong)程(Cheng)目(Mu)的(De)：(?)合(He)金(Jin)焊(Han)点(Dian)形(Xing)成(Cheng)，(?)零(Ling)件(Jian)脚(Jiao)与(Yu)焊(Han)盘(Pan)接(Jie)为(Wei)一(Yi)体(Ti);
110. SMT制(Zhi)程(Cheng)中(Zhong)，(?)锡(Xi)珠(Zhu)产(Chan)生(Sheng)的(De)主(Zhu)要(Yao)原(Yuan)因(Yin)PCB PAD设(She)计(Ji)不(Bu)良(Liang)、(?)钢(Gang)板(Ban)开(Kai)孔(Kong)设(She)计(Ji)不(Bu)良(Liang)、(?)置(Zhi)件(Jian)深(Shen)度(Du)或(Huo)置(Zhi)件(Jian)压(Ya)力(Li)过(Guo)大(Da)、(?)Profile曲(Qu)线(Xian)上(Shang)升(Sheng)斜(Xie)率(Lu)过(Guo)大(Da)，(?)锡(Xi)膏(Gao)坍(Tan)塌(Ta)、(?)锡(Xi)膏(Gao)粘(Zhan)度(Du)过(Guo)低(Di)。(?)
